PRODUCT DESCRIPTION [y]

ABLESTIK ABP 8060T provides the following product characteristics: 

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Technology                :          BMI Hybrid 

Appearance               :          Silver paste 

Product Benefits         :          ● Hydrophobic 

                                         ● Electrically conductive 

                                         ● Thermally conductive 

                                         ● Stable at high temperatures 

                                         ● High die shear strength 

Cure                        :          Heat cure 

Application               :          Die attach 

Typical Package Application :   MOSFET

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ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. 

This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.


TYPICAL PROPERTIES OF UNCURED MATERIAL 

Thixotropic Index (0.5/5 rpm)               :          6.0 

Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm    :      12,000 

Filler Content, %                          :       85 

Work Life @ 25°C, hours               :       24 

Flash Point - See MSDS


TYPICAL CURING PERFORMANCE 

Cure Schedule 

45 minutes ramp from 25°C to 200°C + 60 minutes @ 200°C in N2 or air oven 


Alternative Cure Schedule 

30 minutes ramp from 25°C to 175°C + 60 minutes @ 175°C in N2 or air oven 



Electrical Properties 

Volume Resistivity, ohm-cm      :     2.5×10-5 



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