제품 특성


Application TypeBond
1 Part or 2 Part1 Part
Cure MethodHeat
ChemistryEpoxy/Ag
Material FormLiquid
Cure Temperature (°C)150
Viscosity (cPs)30 (Pa.s)
Cure Time (min)60
High Temperature Resistance (°C)150
Low Temperature Resistance (°C)-45



제품문의  : 010-2184-8948