ABLESTIK CE 3103 WLV


PRODUCT DESCRIPTION 

Ablestik CE3103WLV provides the following product characteristics:


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Technology        :      Epoxy 

Appearance        :      Silver 

Cure                 :      Heat cure 

Product Benefits  :  ? Electrically conductive 

                          ? Pb-free alternative to solder 

                          ? Low cure temperature 

Filler Type         :   Silver Filler 

Weight, %         :   76 

Application        :   Electrically Conductive Adhesive 

Surfaces            :   Sn, Sn/Pb and OSP coated Cu 

Typical Package Application  :   SMD component attach 

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TYPICAL PROPERTIES OF UNCURED MATERIAL 

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Viscosity at 25°C, mPa·s (cP) (Plate 2 cm at 15 s-1 ) : 15,000 to 25,000 

Thixotropic Index                                             : 5.5 

Pot Life @ 25ºC, days                                       : 3 

Shelf Life @ -40°C, months                                : 12 

Flash Point - See MSDS

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TYPICAL CURING PERFORMANCE 

Cure Schedule 10 minutes @ 120°C or 

3 minutes @ 150°C



TYPICAL PROPERTIES OF CURED MATERIAL 

Physical Properties: Coefficient of Thermal Expansion, ppm/ºC  : Below Tg 45 Above Tg 225 

Glass Transition Temperature (Tg) by TMA, °C  :  114 

Modulus @ 25°C, GPa          :    4.5 

Operating temperature, ºC    :    150 

Electrical Properties: Volume Resistivity, ohms-cm    :  0.0008 



TYPICAL PERFORMANCE OF CURED MATERIAL 

Tensile Lap Shear Strength, MPa 13 



제품문의 : 010-2184-8948