TYPICAL PROPERTIES OF UNCURED MATERIAL

 

Base                 : Epoxy 

Appearance        : White liquid 

Viscosity @ 25°C : 350,000-390,000 

Solids content, % : 100 

Specific gravity    : 1.20-1.30 

Flash point, °C     : >200 

Vapour Pressure @ 20°C, mmHg : <0.25 


TYPICAL CURING PERFORMANCE


HEAT CURE 

Typical heat cure conditions consist of heating and maintaining bondline at a temperature given below for the corresponding time specified. 

CP-7412 SR will commence curing upon exposure to temperatures above 80ºC. Adhesive volume, heating temperature and duration will affect cure speed 

and adhesion. Optimum conditions for heat cure should be determined on the actual assemblies. 


Recommended Curing Conditions 

Bondline temperature, °C  : 125 

Heating duration, minutes  : 10 

Bondline temperature, °C  : 100 

Heating duration, minutes : 6.0


TYPICAL PROPERTIES OF CURED MATERIAL


PHYSICAL PROPERTIES 

Appearance            : White polymer 

Hardness, Shore D   : 85-90 

Elongation @ break, % : 5 

Tensile strength @ break, MPa (PSI) : 112 (16,250) 

Modulus, MPa (PSI)  : 3,002 (435,342) 


PERFORMANCE PROPERTIES 

Shear strength (Steel/Steel), MPa (PSI)  : 20.0 (2,905) 


THERMAL PROPERTIES 

Glass transition temperature (Tg), oC   : 115 

Thermal conductivity, mW/K              : 0.75 

Temperature range, oC                     : -40 to 200