[산업/전자] ENSURE CP-7412SR 일액형 에폭시 접착제
TYPICAL PROPERTIES OF UNCURED MATERIAL
Base : Epoxy
Appearance : White liquid
Viscosity @ 25°C : 350,000-390,000
Solids content, % : 100
Specific gravity : 1.20-1.30
Flash point, °C : >200
Vapour Pressure @ 20°C, mmHg : <0.25
TYPICAL CURING PERFORMANCE
HEAT CURE
Typical heat cure conditions consist of heating and maintaining bondline at a temperature given below
for the corresponding time specified.
CP-7412 SR will commence curing upon exposure to temperatures above 80ºC. Adhesive volume,
heating temperature and duration will affect cure speed
and adhesion. Optimum conditions for heat cure should be determined on the actual assemblies.
Recommended Curing Conditions
Bondline temperature, °C : 125
Heating duration, minutes : 10
Bondline temperature, °C : 100
Heating duration, minutes : 6.0
TYPICAL PROPERTIES OF CURED MATERIAL
PHYSICAL PROPERTIES
Appearance : White polymer
Hardness, Shore D : 85-90
Elongation @ break, % : 5
Tensile strength @ break, MPa (PSI) : 112 (16,250)
Modulus, MPa (PSI) : 3,002 (435,342)
PERFORMANCE PROPERTIES
Shear strength (Steel/Steel), MPa (PSI) : 20.0 (2,905)
THERMAL PROPERTIES
Glass transition temperature (Tg), oC : 115
Thermal conductivity, mW/K : 0.75
Temperature range, oC : -40 to 200
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[산업/전자] ENSURE CP-7412SR 일액형 에폭시 접착제
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