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PRODUCT DESCRIPTION


FOTOPOLYMER ESLAST ES-5227 is a single component, modified silicone based adhesive and sealant with excellent flexibility when cured upon exposure to moisture. 

ESLAST ES-5227 is formulated with a non acidic and low odour chemistry that is neutral curing and does not react or corrode with most metals and plastics. 

ESLAST ES-5227’s self levelling flow is developed for conformal coating and for penetrating into small crevices and voids in potting and sealing applications. 

ESLAST ES-5227 cures with excellent environmental resistance and extremely high service temperature.



KEY FEATURES 

- Very rapid curing with moisture for immediate fixturing and assembly

- Formulated for bonding, sealing, coating and potting applications 

- Low viscosity for penetrating of preassembled parts and self levelling flow 

- Suited for polymeric and inorganic substrates such as polycarbonate, polyamide, PET, glass, metal, ceramics etc 

- Extremely high flexibility with very low hardness, low modulus and very high elongation 

- Excellent protective resistance against weathering, moisture, ozone, vibrations, oils, chemicals, ultraviolet, mechanical impacts and temperature extremes 

- Remains flexible and inert over a wide range of temperature 


TYPICAL PROPERTIES OF UNCURED MATERIAL


Base                            :      Modified silicone 

Appearance                  :      Translucent self levelling liquid 

Viscosity @ 25°C            :      30,000-40,000 

Solids content, %           :      98 (contains no solvents) 

Specific gravity              :      1.00-1.10 

Odour                         :      Mild  



TYPICAL CURING PERFORMANCE 


MOISTURE CURE 

At 24°C and 50% relative humidity, ESLAST ES-5227 forms a layer of skin within 5 minutes upon exposure to surface or atmospheric moisture. 

ESLAST ES-5227 beneath the skin continues to cure. Curing time is extended as the thickness of the bondline and volume of adhesive increases. 

A bondline thickness of up to 5 millimetres can be curable after 24 hours. 

Increased thickness may require 3 or 4 days for complete cure. Optimum conditions for moisture cure should be determined on the actual assemblies. 

Not recommend for use in totally confined cure conditions where the sealant is not exposed to atmospheric moisture. 


Recommended Curing Condition 

Bondline temperature, °C    : 25 

Skin over duration, minutes : 5 

Tack free duration, minutes : 15 


TYPICAL PROPERTIES OF CURED MATERIAL


PHYSICAL PROPERTIES 

Appearance Translucent elastomer 

Hardness, Shore A 25 

Elongation @ break, % 300 

Tensile strength @ break, N/mm2 (PSI) 1.0-1.7 (150-250) 


PERFORMANCE PROPERTIES 

Peel strength , N/mm (PPI) 7.0 (40) T


HERMAL PROPERTIES 

Temperature range, oC -60 to 260 

Thermal conductivity, W/mK 0.42 


ELECTRICAL PROPERTIES 

Dielectric constant, 100 Hz 2.7

Dielectric strength, kv/mm 450 

Volume resistivity, Ohm-cm 1.7 x 10E14